Meet X-Dynamics at CIOE 2026: Industrial 3D Sensing Solutions at Booth 6D60
Visit X-Dynamics at Booth 6D60 during CIOE 2026 to explore industrial 3D sensing, long-range dToF modules and wearable multimodal data acquisition technology.
The 27th China International Optoelectronic Exposition (CIOE 2026) will take place in Shenzhen from September 9 to 11, 2026. Bringing together more than 4,000 exhibitors, CIOE is a major international platform covering the entire optoelectronics industry, including intelligent sensing, machine vision, infrared technology, lasers and precision optics.
Wuhan X-Dynamics is pleased to announce its participation in CIOE 2026. We will present our independently developed industrial sensing products and application-oriented solutions at Booth 6D60.
Visitors will be able to explore our latest technologies for industrial 3D vision, long-distance measurement, robotic perception, multimodal data acquisition and intelligent monitoring.
Exhibition Information
Event: The 27th China International Optoelectronic Exposition (CIOE 2026)
Date: September 9–11, 2026
Venue: Shenzhen World Exhibition & Convention Center, China
Booth: 6D60
Industrial Sensing Products for Real-World Applications
At CIOE 2026, X-Dynamics will showcase its iToF industrial depth cameras, dToF single-point laser ranging modules and wearable multimodal data acquisition equipment.
Designed for accuracy, stability and flexible system integration, these products support a wide range of applications, including robotics, smart warehousing, industrial inspection, security monitoring, UAVs, long-range observation, scene reconstruction and industrial field recording.
XD-S200S 905 nm dToF Laser Ranging Module
The XD-S200S is an ultra-lightweight dToF laser ranging module developed for compact and weight-sensitive equipment.
Based on 905 nm dToF technology, it provides a measurement range of 0.1 to 1,200 metres, depending on the target and operating conditions. The module weighs no more than 6.5 g and measures only 10.2 × 16.5 × 25.2 mm, making it easy to integrate into space-constrained systems.
At distances up to 400 m, the ranging accuracy is ±1 m. Beyond 400 m, the accuracy is ±0.4% of the measured distance. The module supports a measurement frequency of 2–4 Hz.
It uses a UART-TTL 3.3 V interface and operates from a 3–5 V DC power supply. The XD-S200S meets Class 1 eye-safety requirements, withstands shocks of up to 1,200 g and operates across a temperature range of −20°C to 60°C.
Typical applications include micro-UAVs, handheld laser rangefinders, ranging sights and other compact distance-measurement equipment.
SE-400 1535 nm Laser Ranging Module
The SE-400 is designed for long-range, eye-safe distance measurement. Operating at a wavelength of 1535 nm, it can measure buildings at distances of up to 4 km and supports multi-target detection.
The module offers ±1 m ranging accuracy, a valid measurement rate of at least 98% and a low false-alarm rate. With a total weight of no more than 15 g, it combines long-distance performance with a compact structure suitable for embedded integration.
The SE-400 supports UART communication and a 3–5 V power supply. It meets Class 1 eye-safety requirements and can withstand shocks of up to 1,200 g, helping it maintain stable performance in demanding operating environments.
It is suitable for electro-optical pods, long-range observation systems, security monitoring equipment and other embedded ranging platforms.
VS-031 Head-Mounted Multimodal Data Acquisition Device
The VS-031 is a lightweight head-mounted device developed for synchronized visual, motion and audio data acquisition.
It features dual synchronized cameras capable of producing 1080p video at an adjustable frame rate of up to 30 fps. A horizontal field of view of at least 130° enables the device to capture a wide area of the surrounding environment.
The device also integrates a six-axis IMU with a sampling rate of 200 Hz and a dual-channel silicon microphone array. Images, motion data and audio can be captured simultaneously, providing synchronized multimodal datasets for subsequent analysis and model development.
Weighing approximately 200 g, the VS-031 combines a lightweight wearable design with Micro SD local storage. Data can be transferred through USB-C or 2.4 GHz/5 GHz dual-band Wi-Fi. It also supports power-bank operation and both local and remote debugging.
Typical applications include real-scene reconstruction, behavioural data collection, industrial field recording, algorithm development and multimodal dataset acquisition.
From Sensor Technology to System Integration
X-Dynamics focuses on independently developed sensing algorithms, hardware optimization and application-specific integration. In addition to standard products, we provide technical consultation, interface adaptation, product customization, sample testing and mass-production support.
Our products combine reliable performance, cost efficiency and flexible integration. They are designed to help customers shorten development cycles and move projects more efficiently from initial testing to commercial deployment.
During CIOE 2026, our team will offer live product demonstrations and one-to-one technical discussions. Visitors are welcome to share their project requirements, including measurement range, target characteristics, installation space, communication interfaces and environmental conditions.
Meet Us at Booth 6D60
From September 9 to 11, 2026, X-Dynamics looks forward to meeting industry professionals, system integrators and technology partners at the Shenzhen World Exhibition & Convention Center.
Visit us at Booth 6D60 to experience our products, discuss integration requirements and explore opportunities for customized development, sample evaluation and commercial cooperation.
If you are unable to attend the exhibition, please contact us to request product catalogues, technical specifications, application information or product samples.
About X-Dynamics
Wuhan X-Dynamics specializes in the research, development, manufacturing and sales of industrial 3D depth-sensing products, infrared thermal imaging modules and dToF laser ranging modules.
We provide both standardized products and ODM services for robotics, industrial automation, intelligent monitoring and other optoelectronic sensing applications.
